Unitepcb domestic and offshore PCB capability
Choosing Unitepcb as your circuit board manufacturer has its benefits. As a member of the Unitepcb family, you’ll experience rapid quote response, flexible lead times, technical support, and engineering services from a leading supplier who is on the cutting-edge of technology offering a variety of PCB solutions – everything you need and want from a PCB supplier.
We offer a wide range of printed circuit board manufacturing capabilities that are in-line with your PCB needs. In order to meet the needs of our diverse customer pool, Unitepcb has both strategic manufacturing partners domestically and overseas so that we are expertly positioned to deliver the right board with the right specifications.
| Technology capability | |||
| PCB | |||
| Item | Standard | Advanced | |
| Layer count | 40L | 60 | |
| Board thickness | 5.5mm | 6.5mm | |
| Aspect ratio | 10:01 | 14:01 | |
| Copper thickness | 6OZ | 12OZ | |
| Maxium PCB size | 1L: | 500×2000mm | 540×2000mm |
| 2L : | 500×1200mm | 540×1200mm | |
| ≥4L: | 540*650mm | 540*650mm | |
| Min. 4L board thickness | 0.38mm | 0.35mm | |
| Min. hole & pad size | 0.20/0.40mm | 0.15/0.35mm | |
| Drilling Acuracy | ±0.05mm | ±0.038mm | |
| Min. solder mask bridge | 0.065mm | 0.065mm | |
| PTH hole size tolerance | ±0.05mm | ±0.038mm | |
| Contour tolerance | ±0.05mm | ±0.05mm | |
| Impedance tolerance | ±8% | ±6%(Differential impedance) | |
| Min. line width/spacing | 0.075/0.075mm | 0.065/0.065mm | |
| Surface finish | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbo | ||
| HDI PCB | |||
| Item | Standard | Advanced | |
| HDI stage | 3+N+3 | Anylayer | |
| Aspect ratio for blind via | 1:01 | 1:01 | |
| Min. 8L board thickness | 0.70mm | 0.65mm | |
| Min. line width/spacing | 0.05/0.05mm | 0.05/0.05mm | |
| Key line/tolerance | 0.065mm/15% | 0.06mm/10% | |
| Min. blind via diameter | 0.10mm | 0.09mm | |
| Min. capture pad size | 0.23mm | 0.20mm | |
| Min. PTH diameter | 0.20mm | 0.175mm | |
| Min. PTH PAD size | 0.35mm | 0.30mm | |
| Min. clearance(copper to SM opening) | 0.038mm | 0.025mm | |
| Min. solder mask bridge | 0.065mm | 0.065mm | |
| Min. CSP/BGA pitch | 0.40mm | 0.35mm | |
| PTH hole size tolerance | ±0.05mm | ±0.038mm | |
| Contour tolerance | ±0.05mm | ±0.05mm | |
| Impedance tolerance | ±8% | ±6%(for differential impedance) | |
| Surface finish | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink | ||
| Flexible PCB | |||
| Item | Standard | Advanced | |
| Layer count | 8L | 12 | |
| Maxium PCB size | 2000*240mm | 2000*240mm | |
| Min. line width/spacing | 1/4OZ | 0.04mm | 0.04mm |
| 1/3OZ | 0.05mm | 0.05mm | |
| 1/2OZ | 0.055mm | 0.055mm | |
| Min. PTH size | 0.15mm | 0.1mm | |
| Min. PTH PAD size | 0.25mm | 0.2mm | |
| Min. blind via diameter | 0.10mm | 0.075mm | |
| Min. capture pad size | 0.25mm | 0.175mm | |
| Min. solder mask bridge | 0.065mm | 0.065mm | |
| Coverlay registration tolerance | 0.15mm | 0.10mm | |
| PTH hole size tolerance | ±0.05mm | ±0.038mm | |
| Contour tolerance | ±0.05mm | ±0.05mm | |
| Impedance tolerance | ±8% | ±6%(for differential impedance) | |
| Min. slot hole width | 0.60mm | 0.50mm | |
| Pitch tolerance | ±0.05mm | ±0.03mm | |
| Air Gap capability | YES | Yes | |
| Surface finish | ENIG, OSP, Gold plating(hard gold) | ||
| Rigid-Flex PCB | |||
| Category | Small and Medium Batches Order (Order area ≥10㎡) | Prototype Order (Order area < 3㎡) | |
| Poduct structure | 1+n+1; 1+1+n+1+1; 2+n+2 | 1+n+1, 1+1+n+1+1, 2+n+2 | |
| F+R, cu+F+cu, R+F+R+F+R, R+F+R | F+R, cu+F+cu, R+F+R+F+R, R+F+R | ||
| Number of layers | Rigid-flex PCB | ≤18L | ≤24L |
| FPC | ≤10L | ≤16L | |
| Board thickness (mm) | Rigid-flex board | 0.3-3.2 | 0.3-3.2 |
| FPC | 0.06-0.35 | 0.06-0.35 | |
| Board size (mm) | Rigid-flex PCB | 15*15 to 310*510 | 15*15 to 310*510 |
| FPC | 5*15 to 310*510 | 5*15 to 310*510 | |
| Copper thickness (OZ) | Maximum copper thickness of FR-4 | Outer layer 2OZ, inner layer 2OZ | Outer layer 2OZ, inner layer 2OZ |
| Maximum copper thickness of FPC | Outer layer 1 OZ, inner layer 1 OZ | Outer layer 2 OZ, inner layer 2 OZ | |
| Minimum copper trace width and spacing capability (um) | 75/75 | 75/75 | |
| Minimum diameter of mechanical drill (mm) | 0.2 | 0.15 | |
| Rigid part material | Tg170 | S1000-2M,IT180A | S1000-2M,IT180A |
| High TG halogen-free | S1165 | S1165 | |
| Thickness of dielectric layer (mm) | 0.1-3.2 | 0.075-3.2 | |
| Flex part material | Flexible material | PI DuPont, Panasonic, Shengyi | PI DuPont, Panasonic, Shengyi |
| Surface insulation layer | Cover film, soldermask | Cover film, soldermask | |
| Thickness of dielectric layer (mm) | 0.025-0.1 | 0.012-0.1 | |
| Surface treatment | Rigid-flex board | HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP | HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger, immersion gold + OSP |
| FPC | FPC | HASL with lead / lead-free, immersion gold, OSP | |